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封装测试/PACKING TESTING >> 晶圆表面缺陷检测系统
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全自动晶圆表面缺陷检测设备 Wafer AOI

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Vi-4202R |
Vi-4304C |
Camera |
4M Monochrome |
4M Color |
Wafer Size |
~200mm |
~300mm |
Handling |
Robot |
Loader |
Open Cassette |
Open Cassette, FOUP, FOSB |
Defect Size(μm) |
1.2/ 2.4 / 5.0 (objective lens 10x / 5x / 2.5x) |
Size |
1600mm(W) x 1300mm(D) x 1800mm(H) |
2280mm(W) x 1140mm(D) x 2060mm(H) |
Weight |
1200kg |
1700kg |
Application |
CMOS image sensor, POWER device, RF filter, BUMP, MEMS |
1. Example of defects

2. Fine detection by area(layer) classification
- The area classification realizes multiple inspection sensitivity and tolerance depending on features of device pattern.
- Each area can have inspection parameters.

3. Refined image by various lighting and color image
- Defects that cannot be detected by grayscale inspection can be detected by color inspection.
- Combination of various light makes invisible defects see.

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