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 封装测试/PACKING TESTING >> 晶圆表面缺陷检测系统

        

      全自动晶圆表面缺陷检测设备   Wafer AOI

    

      

   Vi-4202R  Vi-4304C
Camera  4M Monochrome 4M Color
Wafer Size ~200mm ~300mm
Handling Robot
Loader Open Cassette Open Cassette, FOUP, FOSB
Defect Size(μm) 1.2/ 2.4 / 5.0 (objective lens 10x / 5x / 2.5x)
Size 1600mm(W) x 1300mm(D) x 1800mm(H) 2280mm(W) x 1140mm(D) x 2060mm(H)
Weight 1200kg 1700kg
Application CMOS image sensor, POWER device, RF filter, BUMP, MEMS

  

1. Example of defects

2. Fine detection by area(layer) classification

  • The area classification realizes multiple inspection sensitivity and tolerance depending on features of device pattern.
  • Each area can have inspection parameters.

3. Refined image by various lighting and color image

  • Defects that cannot be detected by grayscale inspection can be detected by color inspection.
  • Combination of various light makes invisible defects see.

   

 

   

 

 

 

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